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| Philips Semiconductors Objective specification Damper diode fast, high-voltage FEATURES * Low forward volt drop * Low forward recovery voltage * Fast switching * Soft recovery characteristic * High thermal cycling performance * Isolated mounting tab BY559X-1500U SYMBOL QUICK REFERENCE DATA VR = 1500 V VF 1.4 V Vfr 10 V trr 120 ns IF(PEAK) = 10 A IFSM 150 A k 1 a 2 GENERAL DESCRIPTION A double diffused rectifier diode in a plastic envelope, featuring fast forward and reverse recovery and low forward voltage. The device is intended for use as a damper diode in horizontal deflection circuits of large screen monitors and workstations . The BY559X series is supplied in the conventional leaded SOD113 package. PINNING PIN 1 2 tab DESCRIPTION cathode anode isolated SOD113 case 1 2 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL VRRM VRWM IF(PEAK) IFRM IFSM Tstg Tj PARAMETER Peak repetitive reverse voltage Crest working reverse voltage Peak working forward current Peak repetitive forward current Peak non repetitive forward current Storage temperature Operating junction temperature CONDITIONS MIN. -40 MAX. 1500 1300 10 150 160 150 150 UNIT V V A A A C C f = 130 kHz; t = 100 s t = 10 ms sinusoidal; Tj = 150 C prior to surge; with reapplied VRWM(max) ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 C unless otherwise specified SYMBOL Visol PARAMETER R.M.S. isolation voltage from both terminals to external heatsink CONDITIONS f = 50-60 Hz; sinusoidal waveform; R.H. 65% ; clean and dustfree MIN. TYP. MAX. 2500 UNIT V Cisol Capacitance from both terminals f = 1 MHz to external heatsink - 10 - pF September 1998 1 Rev 1.100 Philips Semiconductors Objective specification Damper diode fast, high-voltage THERMAL RESISTANCES SYMBOL Rth j-hs Rth j-a PARAMETER Thermal resistance junction to heatsink Thermal resistance junction to ambient CONDITIONS with heatsink compound in free air. MIN. - BY559X-1500U TYP. 55 MAX. 3.6 - UNIT K/W K/W STATIC CHARACTERISTICS Tj = 25 C unless otherwise stated SYMBOL VF IR PARAMETER Forward voltage Reverse current CONDITIONS IF = 6.5 A IF = 6.5 A; Tj = 125 C VR = VRWMmax VR = VRWMmax; Tj = 125 C MIN. TYP. 1.5 1.2 MAX. 1.8 1.4 0.5 2.0 UNIT V V mA mA DYNAMIC CHARACTERISTICS Tj = 25 C unless otherwise stated SYMBOL Vfr tfr trr Qs PARAMETER Forward recovery voltage Forward recovery time Reverse recovery time Reverse recovery charge CONDITIONS IF = 6.5 ; dIF/dt = 50 A/s IF = 6.5 A; dIF/dt = 50 A/s; VF = 5 V IF = 1 A; -dIF/dt = 50 A/s; VR 30 V IF = 2 A; -dIF/dt = 20 A/s; VR 30 V MIN. TYP. 6 130 90 0.2 MAX. 10 180 120 0.25 UNIT V ns ns C September 1998 2 Rev 1.100 Philips Semiconductors Objective specification Damper diode fast, high-voltage MECHANICAL DATA Dimensions in mm Net Mass: 2 g 3.2 3.0 10.3 max BY559X-1500U 4.6 max 2.9 max Recesses (2x) 2.5 0.8 max. depth 2.8 6.4 15.8 19 max. max. seating plane 15.8 max 3 max. not tinned 3 2.5 13.5 min. 1 0.4 M 2 1.0 (2x) 0.6 2.54 5.08 0.5 2.5 0.9 0.7 Fig.1. SOD113; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1998 3 Rev 1.100 Philips Semiconductors Objective specification Damper diode fast, high-voltage DEFINITIONS Data sheet status Objective specification Product specification Limiting values BY559X-1500U This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1998 4 Rev 1.100 |
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